Multi-Chip Module Design, Verification, and Yield Optimization

Title: Multi-Chip Module Design, Verification, and Yield Optimization
Publication: Microwave Product Digest
Date: October 2016
URL: http://www.mpdigest.com/2016/10/24/multi-chip-module-design-verification...
 
Abstract:
Multi-technology-based module design incorporates different integrated circuit (IC) and printed circuit board (PCB) process technologies implemented with different design tools. To offer smaller devices with optimum performance, it is common for FEM manufacturers to integrate GaAs, SiGe, or RF CMOS PAs, CMOS or SOI switches, and acoustic filters—all mounted on a single laminate package. This article presents a unified design flow for full module simulation, inclusive of all process technologies, that enables designers to leverage the strengths of specialized electromagnetic (EM) modeling and circuit analysis tools to address various functional block technologies, maintaining all through a single environment.