EDI CON 2013

Mar 12, 2013 to Mar 14, 2013
Event location: 
Beijing, China

Venue:
Beijing International Convention Center, Beijing, China

Booth:
AWR will be sharing a booth with National Instruments and is a gold sponsor. Booth number is 255. For a free VIP conference tickets contact Tracy Bai at tracy.bai@awrcorp.com.

AWR Presentations:

Wednesday 13, March – 9:15 - 9:30
Antenna Design IA
Design of a Novel Multi-Slot Antenna
Dr. Milton Lien, AWR

Wednesday 13, March – 15:30 - 16:10
MMIC Design Workshop
Design Methodology for GaAs MMIC, 1 W X-Band PA
Dr. John Dunn, AWR

Thursday 14, March – 8:30 - 8:50
RF Power Amplifiers IIA
Device Characterization Methods for Advanced RF/Microwave Design
Dr. Milton Lien, AWR

Thursday 14, March – 10:35 - 10:55
Power Devices
Simulating an NXP Doherty Power Amplifier with Digital Pre-Distortion
Dr. John Dunn, AWR

Thursday 14, March – 10:55 - 11:15
Power Devices
Optimizing the Design and Verification of 4G RF Power Amplifiers
Peter Xu, AWR

Thursday 14, March – 15:45 - 16:45
EDA Design Flow Workshop and Panel
Fully Integrating 3D Electromagnetic (EM) Simulation into Circuit Simulation
Dr. John Dunn, AWR

Thursday 14, March – 17:15 - 18:00
EDA Design Panel

Thursday 14, March – 17:15 - 18:00
RF Front-End and DPD Technology Panel

URL:
http://www.ediconchina.com/

Additional Information:
EDI CON 2013 is an opportunity for design engineers and system integrators to learn about the latest RF/Microwave and high-speed digital products, design tools and technologies for today's communication, computing, RFID, industrial wireless monitoring, navigation, aerospace and related markets. A focus on enhancing physical design, emerging technologies and practical engineering solutions, brings together designers at the forefront of Chinese innovation and the world's leading technology companies.