NI AWR Software Training: 2-Day Advanced EM Concepts For Microwave Office

May 2, 2017 to May 3, 2017
Event location: 
Boston, MA

In this two-day class, we look at some of the more advanced and powerful electromagnetic (EM) simulation concepts in Microwave Office (MWO). We will focus on Microwave Office’s 3D simulator, Analyst, and planar simulator, AXIEM. Many of the features and concepts discussed can also be used with the AWR Connected EM flows for HFSS and CST. 

The class is intended for experienced users who want to increase their understanding of EM simulation issues, and how to more effectively and efficiently work inside of Microwave Office’s EM environment. Less experienced users of the software should still find the topics of interest and are welcome to attend. (Note: Many of the features and concepts also apply to Microwave Office’s EM Socket flows to HFSS and CST.) 

Advanced EM Features we will show:

  • Hierarchy in EM Layout – especially with mixed technologies: e.g., chip and board
  • Creating and Controlling 3D Layout Cells
  • Using pre-processing rules to your advantage
  • Shape Modification Rules
  • The EM Schematic and Pcells
  • Extraction for Analyst: basic extraction and advanced features, e.g., hierarchy, and port control
  • Setting up Remote Simulation
  • Working with Negative Layers

Course Equipment/Hardware:

  • Bringing your own laptop is preferred. If necessary, a laptop can be provided
  • Special note: 64-bit PCs are required to run the software
  • Software, licenses, and required training materials will be provided

Agenda Day 1 - Planar Layout Control and EM Socket Features:

9:00 a.m. Introduction and Overview
9:15 a.m. A Tour of the EM Socket Environment
10:30 a.m. Break
10:45 a.m. Hierarchy and mixed technology simulations
12:00 p.m. Lunch
12:30 p.m. Hierarchy and mixed technology simulations - continued
2:00 p.m. Controlling Planar Layout with Shape Modifiers. Pcells, and Pre-processing rules
3:00 p.m. Break
3:15 p.m. Continuation of Layout Issues
4:00 p.m. Conclusion


Agenda: Day 2 – 3D Layout Control, Meshing and Simulation:

9:00 a.m. The 3D Layout Enviroment – 3D Cell Creation and Control
10:30 a.m. Break
10:45 a.m. Boundary Conditions – Settings and Issues
12:00 p.m. Lunch
12:30 p.m. Port Issues in EM Simulators: Ground, Wave Ports, Calibration
2:30 p.m. Break
2:45 p.m. Advanced Extraction for Analyst and AXIEM
4:00 p.m. Conclusion