NI AWR Software Training: 2-Day Advanced EM Concepts For Microwave Office

Mar 21, 2018 to Mar 22, 2018
Event location: 
Santa Clara, CA

This two-day class looks at the advanced and powerful EM simulation concepts in Microwave Office and focuses on Microwave Office AXIEM 3D planar and Analyst™ 3D finite element method EM simulators. Many of the features and concepts discussed can also be used with the AWR Connected™ EM flows for HFSS and CST. 

The class is intended for experienced users who want to increase their understanding of EM simulation issues,and how to more effectively and efficiently work inside the Microwave Office EM environment. Less experienced users of the software will still find the topics of interest and are welcome to attend. (Note: Many of the features and concepts also apply to the Microwave Office EM Socket™ flows to HFSS and CST.) 

Advanced EM Features we will show:

  • Hierarchy in EM layout – especially with multi-technologies such as chips and boards
  • Creating and controlling 3D layout cells
  • Taking advantage of pre-processing rules 
  • Shape modification rules
  • The EM schematic and PCells
  • Extraction for Analyst: basic extraction and advanced features such as hierarchy and port control
  • Setting up remote simulation
  • Working with negative layers

Course Equipment/Hardware:

  • Bringing your own laptop is preferred. If necessary, a laptop can be provided.
  • Special note: 64-bit PCs are required to run the software.
  • Software, licenses, and required training materials will be provided.
     

Agenda Day 1 - Planar Layout Control and EM Socket Features:

9:00 a.m. Introduction and overview
9:15 a.m. A tour of the EM Socket environment
10:30 a.m. Break
10:45 a.m. Hierarchy and multi-technology simulations
12:00 p.m. Lunch
12:30 p.m. Hierarchy and multi-technology simulations - continued
2:00 p.m. Controlling planar layout with shape modifiers, PCells, and pre-processing rules
3:00 p.m. Break
3:15 p.m. Continuation of layout issues
4:00 p.m. Conclusion

 

Agenda: Day 2 – 3D Layout Control, Meshing and Simulation:

9:00 a.m. The 3D layout environment – 3D cell creation and control
10:30 a.m. Break
10:45 a.m. Boundary conditions – settings and issues
12:00 p.m. Lunch
12:30 p.m. Port issues in EM simulators: ground, wave ports, and calibration
2:30 p.m. Break
2:45 p.m. Advanced extraction for AXIEM and Analyst
4:00 p.m. Conclusion