EDI CON China 2018

Mar 20, 2018 to Mar 22, 2018
Event location: 
Beijing, China

China National Convention Center

Expo Hours:
Tuesday, Mar 20 | 11:00 a.m. - 5:30 p.m.
Wednesday, Mar 21 | 10:00 a.m. - 5:00 p.m.
Thursday, Mar 22 | 10:00 a.m. - 3:00 p.m.

NI AWR software will be on display at the NI booth #409.

NI is an EDI CON 2018 Corporate Sponsor.

NI AWR Software Demonstrations:

  • What’s New in NI AWR Design Environment
  • Microwave Office for Microwave Monolithic Integrated Circuit (MMIC), RF Printed Circuit Board (PCB) and Module Design
  • Visual System Simulator™ (VSS) for Wireless Communications and Radar Systems
  • Analyst™ and AXIEM Electromagnetic (EM) technology for Interconnect Analysis
  • AntSyn™ for Antenna Synthesis and Optimization

NI AWR Software Presentations:

  • Simulation of BER, EVM and ACPR Performance under Proposed 5G Modulation Waveforms - Presented by Lars Van Der Klooster, AWR Group, NI

    • 12:05 - 12:25  | Tue, Mar 20 | Rm 406
  • MIMO Antenna Synthesis - Presented by Milton Lien, AWR Group, NI
    • 10:55 - 11:15 | Wed, Mar 21 | Rm 406

NI AWR Software Sponsored Workshops/Courses:

  • Rapid Design Method for GaN HEMT Asymmetric Doherty PA Workshop - Presented by Zhancang Wang, Ericsson Beijing

    • 2:15 - 2:55  | Tue, Mar 20 | Rm 403


Additional Information:
EDI CON China celebrates electronic design innovation, bringing together RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators for networking, training, and learning opportunities. Attendees come to EDI CON to find solutions, products, and design ideas that they can put into immediate practice for today's communication, defense, consumer electronics, aerospace, and medical industries. Drawing attendees from both the analog and digital spheres, with special focus on EMC and Radar through its partnerships, EDI CON enables designers to see techniques and technologies used in other applications that could be applied or adapted to solve their latest design challenges. The exhibition hall features product displays, demonstrations, networking opportunities, and poster sessions that address all aspects of design, simulation, test, and verification.