AXIEM

3D Planar Electromagnetic (EM) Analysis

AXIEM software is the 3D planar electromagnetic (EM) analysis software found within the NI AWR Design Environment platform. Its fast solver technology readily addresses passive structures, transmission lines, large planar antenna and patch array problems with more than 100K unknowns. Whether characterizing and optimizing passive components on RF PCBs, modules, LTCCs, MMICs, RFICs, or antennas, AXIEM has the accuracy, capacity, and speed designers need to ensure right the first time. 


Recent Additions

The latest release of NI AWR Design Environment platform, specifically the AXIEM software, provides for new and expanded capabilities. Highlights include:

  • Improved Meshing/Solver Efficiency – Multiple enhancements to the AXIEM meshing technology provides more efficient simulations with faster analysis run times
  • Point Ports – Provides precise placement of lumped-element model connection points within an EM structure for circuit/EM co-simulation of designs based on surface-mount components on PCBs. 
  • Integration Within the Cadence Virtuoso RF Solution – Provides fast solver technology to address passive structures, transmission lines, large planar antenna and patch array problems directly within the Cadence Virtuoso design environment for RFIC/RF module design and analysis. (contact a Cadence representative to learn more)

Learn more: What's New


Applications

  • On-Chip and Off-Chip Passives
  • IC, PCB and Module Interconnects
  • Extraction of Critical Transmission Lines (Nets)
  • Design Verification of Layout
  • Antenna Design and Analysis 

Product Features

At-a-Glance

  • EXTRACT - Schematic-driven EM extraction technology/design flow
  • Layout/Drawing Editor - 2D and 3D views
    • Shape pre-processing (rule-based shape modifiers/de-featuring)
  • MoM - Proprietary full-wave planar Method of Moments technology
    • Open-boundary MoM
    • Discrete- and fast-frequency sweeps
  • Meshing Technology - Automatic adaptive meshing
    • Advanced hybrid meshing technology
    • Thick metal support
    • Surface roughness
  • Sources - Numerous excitations
    • Auto-calibrated internal ports
    • Ports-only mode
  • Visualization - Field visualization as well as results post-processing
    • Antenna analysis and post-processing
  • Parametric Studies - Leading to optimization, tuning, and yield analysis
    • Geometrically-aware and optimized
  • HPC - Support for 64-bit PC platform, multi-core configurations, and asynchronous simulation 

Supported Technologies

  • MMIC - Design flows and process design kits for working with GaAs/GaN foundries
  • PCB - Single and multi-layer board modeling, simulation and layout solutions 
  • Modules - Multi-technology packaging modeling and simulation solutions for MMIC/RFIC, chip/package/board interconnects and embedded passives 
  • RFIC - Mixed-signal and Silicon RF design
  • Systems - EM, circuit, and system co-simulation

 

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