NI AWR Software Newsletter | Oct 2017


In This Issue

NI AWR Design Environment V13.03 Released

NI AWR Design Environment V13.03 has been released and is available for use by current customers and evaluators. Several new examples, 3D electromagnetic (EM) elements and as well as a host of useful enhancements, have been added to the latest release. Refer to the software's What's New documentation for complete details.

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New PDK for ON Semiconductor IPD Process Now Available

NI AWR Design Environment has added PDK support for ON Semiconductor’s integrated passive devices (IPDs) process. Developed in conjunction with NI AWR software experts, the ON Semiconductor IPD PDK is ideal for fabrication of passive devices such as baluns, filters, couplers, diplexers, and matching networks that are used in portable, wireless, and RF applications.

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Quasonix Achieves First-Pass Success With a Transmitter’s Filter Design 

Quasonix, a provider of high performance aeronautical telemetry products, developed a method to successfully design a transmitter’s low-pass harmonic filter in a single pass using NI AWR Design Environment and component models from Modelithics® CLR library to cut board iterations.

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New Application Notes Added to Resource Library

EM Simulation Within a High-Frequency Circuit Design Flow
This new application note addresses challenges in integration and parameterization of EM simulation within a high-frequency circuit design flow.
EM Simulation/Verification of a Cadence Allegro PCB
This new application note outlines steps for EM simulation of a Cadence Allegro PCB design within NI AWR Design Environment.

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NI Days
Nov 7
Paris, FR
Antennas & Propagation Conference
Nov 13 - 14
Loughborough, UK
Nov 13 - 14
Tel Aviv, IL
MWE 2017
Nov 29 - Dec 1
Yokohama, JP
IMaRC 2017
Dec 11 - 13
Ahmedabad, IN
Simulating a 200W L Band Push-Pull GaN Power Amplifier
Nov 15

Load Modulation in Microwave Circuit Design (Recording)

Dr. Steve Cripps's Microwave Week 2016 MicroApps keynote is now available to view (registration required).

PA Design: Advanced Source Pull, Harmonic/Modulated Signal Load Pull and Circuit Envelope

Module Design: Multi-Technology Design Flow Improvements
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