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NI AWR Design Environment, inclusive of Microwave Office, Visual System Simulator, AXIEM and Analyst, is provided to colleges and universities through a number of programs that support both teaching and public research interests. The software offering encompasses linear, nonlinear, transient, electromagnetic, and system simulation engines, as well as full layout capabilities.

What's New

  • Graduate Gift Initiative is a program that's designed to give graduating engineering students a career head start by providing on-going exposure and experience using NI AWR software.
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  • Professors in Partnership is a program specifically designed to provide engineering students, faculty, and graduates with access to ongoing microwave and RF educational content that highlights NI AWR software.
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  • University Success Stories detail how various academic institutions benefit from access to NI AWR software.  
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RF Circuit Design / Electromagnetics / Communication Theory

  • Microwave Office  - For the study of basic and/or advanced RF circuit design with distributed transmission-line models, vendor component libraries, design entry, frequency- and time- domain circuit simulation and readily guides the student from an ideal schematics to a complete physical layout.
  • AXIEM and Analyst - Empowers students to perform 3D electromagnetic (EM) verification of planar RF/microwave structures as well as arbitrary 3D structures such as filters, antennas and distributed passive structures with these EM technologies
  • Visual System Simulator™ - Commonly used to perform system and RF budget analysis for defining component/system specifications, RF Inspector for spurious signal analysis through signal chain and circuit co-simulation and optimization of digitally-modulated power amplifiers.

Circuit / System / EM Simulation Products

  • Microwave Office - RF and microwave circuit analysis

    • Design capture with industry-leading tuning
    • Linear and nonlinear frequency- and time-domain simulation
      • APLAC harmonic balance for large-scale and highly nonlinear designs
    • Synthesis, optimization, and yield analysis
    • Load Pull generates contours from active device models or plot measured data for impedance matching
  • AXIEM and Analyst - 3D planar and 3D finite element method (FEM) EM​​ analysis for passive device and antenna modeling
  • Visual System Simulator - Communication systems, circuit-envelope analysis, and design partitioning/integration

Models and Libraries

Manufacturing and Test

  • Layout Tools - With production-ready GDSII export

Supported Technologies

  • Systems - Circuit and system co-simulation of wireless communication metrics such as adjacent channel power ratio (ACPR), error vector magnitude (EVM), and related digital modulation analysis
  • Modules - Multi-technology packaging modeling and simulation solutions for MMIC/RFIC, chip/package/board interconnects and embedded passives
  • RFICComplete small-scale or large-scale RFIC RF front-end design with native or third-party schematic/layout entry, fully integrated EM extraction, and circuit analysis
  • MMIC - Design flows and process design kits (PDKs) for working with gallium arsenide/gallium nitride (GaAs/GaN) foundries
  • PCB - Single and multi-layer board modeling, simulation, and layout solutions 

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