RFIC Design

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NI AWR Design Environment offers communication IC​ designers a platform to develop complete small-scale RFICs or RF front-ends for large-scale RFICs from system- to transistor-level design with native or 3rd party schematic/layout entry, fully integrated EM extraction for interconnects and on-chip passive components co-simulated with frequency (harmonic balance) and time (transient) domain circuit analysis. 


What's New

  • Design for Manufacturing addresses design sensitivity to specific component and manufacturing tolerances, compensating for the impact of these variations on the overall design performance and enabling designers to achieve a more robust product.  
  • EM for RFICs for when it comes to full-chip analysis; the diversity of structure geometries and scale pose a significant challenge for any single EM simulation technology.  
  • Integration Within the Cadence Virtuoso RF Solution provides fast solver technology to address passive structures, transmission lines, large planar antenna and patch array problems directly within the Cadence Virtuoso design environment for RFIC/RF module design and analysis. (Contact a Cadence representative to learn more.)

Features

Design Entry  / Extraction / Simulation

  • Analog Office - Provides comprehensive simulation of RFIC technologies from system to final tape-out. RF/microwave-aware active and passive device models combine with Silicon foundry PDKs and Spectre netlist support to accurately capture the behavior of RF front-end blocks within an RFIC design. 
  • AXIEM and Analyst™ - 3D EM solvers provide S-parameter extraction of transmission lines, on-chip passives, ball-grid arrays, flip-chips, and wire bonds for post-layout verification.
  • NI AWR Design Environment - Integrates system-level analysis via Visual System Simulator™ (VSS) with Analog Office's harmonic balance, frequency- and time-domain analysis for RFICs. Define front-end architectures, budget RF blocks with simulation-ready behavioral models and simulate/optimize digitally modulated RF metrics such ACPR, EVM or BER.

Circuit / System / EM Simulation Products 

  • Analog Office - Circuit analysis with linear and nonlinear frequency and time-domain simulation

    • Design capture with industry-leading tuning
    • Linear and nonlinear frequency- and time-domain simulation​
      • APLAC RF harmonic balance for large-scale and highly nonlinear designs
    • HSPICE (and APLAC) simulation including transient/time-domain, AC and noise analysis extraction technology
    • ACE™ automated circuit extraction technology for interconnect modeling
    • OEA International NET-AN for 3D RLCK extraction​
  • Microwave Office - MMIC and RF PCB circuit analysis
    • Design capture with industry-leading tuning
    • Linear and nonlinear frequency- and time-domain simulation
      • APLAC harmonic balance for large-scale and highly nonlinear designs 
  • AXIEM and Analyst - 3D planar and 3D finite element method (FEM) EM​​ analysis for bumps, bond wires, ribbons
  • EM Socket -  Interoperability with ANSYS, CST, and Sonnet EM software products
  • Visual System Simulator - Communication systems, circuit-envelope analysis, and design partitioning/integration

Models and Libraries

Manufacturing and Test


Supported Technologies

  • LDMOS - Nonlinear models for high power transistors and RF ICs that simulate electrical phenomena and account for dynamic self-heating
  • SiGe - Delivers superior performance over standard silicon bipolar processes at a comparable cost level
  • CMOS SOI - Offers specific additional design advantages that include a significant reduction in cross-talk between RF and digital circuits on the same die and easy integration of high quality passive elements 
  • RF-CMOS - Analog Office offers select foundry PDKs for this low-cost, high-volume CMOS process technology developed for high-frequency electronics that support the integration of RF and baseband components onto a single chip

RFIC Design - Video Gallery